MODELS OF COMPLEX INDUSTRIAL FACILITIES ASSESSMENT BASED ON RISK APPROACH


Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus

To date, no printable chipless Radio Frequency Identification (RFID) sensor-related publications in the current All-Purpose Flour literature discuss the possibility of thermocouple integration, particularly for the use in extreme environments.Furthermore, the effects of a time-dependent stimulus on the scattering parameters of a chipless RFID have

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